- Purity:Protect the contamination of silicon wafers by magazines during processing.
- Strong Permeability:Uniformly breathable and water-permeable, to ensure that the silicon wafer is evenly stressed and firmly adsorbed, and does not slide during the grinding process.
- Uniform Structure Distribution:Not easy to absorb silicon powder abrasive debris, and the suction cup is easy to clean.
- High Strength:No deformation during grinding, to ensure that the silicon wafer is uniformly stressed at all points during grinding, and it is not easy to produce edge collapse and debris.
- Easy to Trim:No breakage, chipping, threshing, etc. during trimming.
- High Insulation:Insulation material to eliminate static electricity.
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